Ch. 1426Subprogram
The research institute’s director announced its 7nm lithography achievements and outlined plans for 3nm-class chips, new chip architectures, and operating systems, prompting major companies to prepare for cooperation. Jiang Yan Hai planned to release Er Dan’s expanded subprogram while keeping its hidden global reach and destructive potential secret.
- The research institute’s external affairs director told company heads that its 7nm lithography machines could be manufactured domestically and would outlast comparable ASML machines.
- The company heads agreed to place substantial orders after hearing about the institute’s production capacity and component manufacturing plans.
- The director announced that Huawei could begin designing 3nm-class chips, a new chip architecture was in development, and a related institute would launch new operating systems.
- The company heads reacted with shock as they considered the implications of 3nm chip design and emerging materials such as Graphene.
- Jiang Yan Hai prepared to have Er Dan release an expanded subprogram that would not replicate or spread, while keeping its concealed presence in devices worldwide and its potential impact secret.