Chips have been a long-standing pain for Chinese people and are difficult to solve.
Of course, this solution is only for high-end chips. The nanometer process is in the range of 3-20 nanometers. Above 20 nanometers, it has basically been overcome, and the problem is not too big.
Only in the range of 3-20 nanometers, every time it is reduced by one level, the difficulty of the Lithography Machine and process required becomes an order of magnitude higher, and it is even said to be as difficult as climbing to the sky.
I don't know how many foreign technology experts have asserted that even if they are given domestic drawings, they cannot be manufactured domestically.
Because this kind of thing is just like the atomic bomb. The design principle is very simple, but it is extremely difficult to actually do it. It cannot solve the problems of raw materials, equipment, technology, etc. at all. To a certain extent, the chip is more difficult than the atomic bomb. The atomic bomb only needs to be able to explode. The size is not too important, but the smaller the chip, the better. They are all going to the electronic level.
However, whether it is equipment, raw materials, auxiliary materials, etc., there are great shortcomings or even blanks in China.
Under such circumstances, manufacturing a high-end chip is indeed as difficult as climbing to the sky.
In terms of chip design, Zhong Zheng Company, after decades of continuous investment, can now be said to be unique in the world, enough to compete with the world's top Eagle Country.
However, the chip manufacturer Zhong Zheng Company had no use for the chip he designed himself and could not find a place to produce it. This forced Zhong Zheng Company to do it himself and discuss solutions with many domestic manufacturers.
As far as the news that Zhou Feiyu has seen, there are reports from time to time that Zhong Zheng Company has made this breakthrough and made that innovation.
Well, the chip design was also played by Zhong Zheng Company.
Heterogeneous, overlapping and other solutions were first announced at a press conference and were criticized by many trolls. However, Certain Fruit followed soon after. The trolls immediately said that Certain Fruit is the real technology company and can truly make good chips. Zhou Feiyu said: You guys are really fucking talented people. Without thirty or forty years of cerebral thrombosis, you wouldn't be able to come up with such a double-standard rhetoric.
"... We noticed that the FY-02 Polyimide Material developed by President Zhou has very excellent performance, far exceeding the products produced by foreign Tian Feng Chemical and King Material. So we thought, with Can President Zhou's ingenuity be used for research and development in the direction of photosensitive polyimide? Although our test sample of Overlapping Chip is successful, the yield rate is extremely low and the circuit accuracy cannot be reached. In addition to equipment accuracy, Photoresist is also a very important reason..."
In the subsequent meeting, Yu Longguang and Zhou Feiyu talked about some situations of Zhong Zheng Company and about Photoresist.
Zhong Zheng Company's internal secrets must not be disclosed by Yu Longguang. What he said are only some things that can be said, or some details that he has not announced to the outside world.
At this time, except for Zhong Zheng Company and Zhou Feiyu, everyone else in the conference room was cleared out.
According to Yu Longguang, for the sake of confidentiality, please Zhou Feiyu understand.
"Photosensitive Polyimide Material?"
Zhou Feiyu's heart moved, and some relevant knowledge about the ultra-thin and special-performance films in "Intermediate Thin Film Technology" immediately came to mind.
Among them, it does mention some photosensitive Polyimide Material that can be used with Photoresist.
Photoresist, as the name suggests, is a glue used for photolithography.
The so-called photolithography literally means engraving with light.
Of course, natural light and various extreme ultraviolet rays cannot directly engrave things like a knife. Only ultra-high-energy lasers can be used for direct engraving.
Photolithography in the field of wafers uses certain glues that are very sensitive to light and evenly spreads them on the wafer. Then a thin film is attached to the surface of the glue. This thin film is designed into the required circuit pattern. Light passes through the circuit pattern and hits the surface of the glue. The glue reacts because it is sensitive to light, revealing a circuit pattern that is the same or opposite to the circuit pattern. Those places that are not illuminated by the light are naturally covered with glue.
The wafer is then immersed in a specially prepared solution.
In this way, the wafer is protected and unchanged in the area covered by the glue. And in those places where there is no glue, the special solution will corrode the wafer.
Traces of corrosion are naturally the same as or opposite to the circuit pattern.
The wafer is taken out of the special solution and rinsed with pure water, leaving the required circuit pattern on it.
Therefore, it is not so much photolithography as it is etching and corrosion engraving. However, this kind of "corrosion engraving" is N levels higher in accuracy than the commonly known etching engraving.
This is the general principle, but easier said than done.
A small chip and integrated circuit are like a small world, and the precision inside is calculated in nanometers.
Just for the Photoresist used for auxiliary production, the thickness limit is also calculated in nanometers.
For example, for the Chip Manufacturing produced in the 20-nanometer process, the Photoresist thickness required cannot exceed 100 nanometers. For the more advanced 3-10nm Process wafer, the Photoresist thickness required can be imagined.
Zhou Feiyu thought secretly for a while and knew that Fei Yang New Material's current equipment and process capabilities are not yet up to this technology, and it will take a period of development and expansion.
"For the convenience of disclosure, which company is Zhong Zheng Company currently jointly developing with?"
Zhou Feiyu didn't say anything, but asked.
"Currently Zhong Zheng Company is cooperating with Hua Ke New Material Company of Jinling. It is expected to complete the testing work of Arf Line Photoresist this month and enter the trial production stage next month."
Yu Longguang didn't hide anything anymore and spoke directly.
Of course, after saying this, I did not forget to tell Zhou Feiyu to pay attention to confidentiality.
"Understood."
Zhou Feiyu nodded, knowing that Zhong Zheng Company was trying every possible means to return to the mobile phone chip industry, so that after seeing his material research and development capabilities, Yu Longguang came over to chat with him.
However, he didn't believe Yu Longguang's statement that the Arf Line Photoresist test would be completed this month and trial production would begin next month. How could such a fast and smooth test be possible?
Seeing that his reaction was not great, Yu Longguang felt a little disappointed. Then he sighed and said, "The Photoresist field is technically difficult, the market capacity is small, and the verification cycle is long. Indeed, many people, companies or groups are unwilling to invest in this area. If President Zhou has no such idea, we can understand."
Indeed, Photoresist this field is difficult, has no future, and is difficult.
There are only a few players. Even if you produce Photoresist, you can't verify whether the glue is good or bad, because there are only a few Chip Manufacturing manufacturers, and there are only a few manufacturers producing Lithography Machine. They will neither change suppliers easily, nor will they verify a New Material casually.
The monopoly and stubbornness of the industry, as well as the high difficulty of technology, have blocked people's interest in investing.
"Director Yu Your provocation..."
Listening to his words, Zhou Feiyu chuckled.